Main Materials
| Electrical Data | Symbol | Main Materials | ||||||||||||||
| P-659 | P-660 | P-663 | P-664 | P-666 | P-667 | P-668 | P-669 | P-672 | P-673 | P-676 | P-678 | P-679 | P-690 | |||
| Piezo-electric coupling coefficient | kp | 0.58 | 0.70 | 0.67 | 0.67 | 0.78 | 0.10 | 0.68 | 0.62 | 0.70 | 0.68 | 0.7 | 0.72 | 0.65 | 0.74 | |
| k31 | 0.32 | 0.39 | 0.38 | 0.37 | 0.42 | 0.39 | 0.35 | 0.41 | 0.39 | 0.45 | 0.42 | 0.38 | 0.40 | |||
| k33 | 0.60 | 0.73 | 0.70 | 0.70 | 0.78 | 0.70 | 0.68 | 0.72 | 0.70 | 0.80 | 0.72 | 0.70 | 0.75 | |||
| kt | 0.42 | 0.46 | 0.45 | 0.45 | 0.50 | 0.45 | 0.46 | 0.44 | 0.46 | 0.46 | 0.50 | 0.47 | 0.46 | 0.48 | ||
| Relative dielectric constant | εT33 / ε0 | 1100 | 3200 | 2200 | 2800 | 4500 | 180 | 2300 | 1400 | 3400 | 2200 | 6000 | 2750 | 1600 | 3800 | |
| Piezo-electric charge constant |
d33×10-12C/N |
280 | 700 | 400 | 480 | 780 | 70 | 430 | 250 | 600 | 430 | 850 | 540 | 320 | 710 | |
|
d31×10-12C/N |
-120 | -350 | -200 | -350 | -230 | -130 | -280 | -230 | -420 | -260 | -150 | -360 | ||||
| Mechanical quality factor | Qm | 100 | 60 | 80 | 500 | 60 | 2500 | 90 | 1000 | 80 | 90 | 60 | 80 | 1000 | 70 | |
| Frequency constant |
fr·d kHz·cm |
230 | 190 | 200 | 220 | 180 | 200 | 230 | 190 | 200 | 180 | 190 | 230 | 190 | ||
|
fr·t kHz·cm |
210 | 200 | 200 | 225 | 200 | 225 | 200 | 200 | ||||||||
| Temp charac-teristics |
| TKfr | (-20℃~80℃) |
100 | 260 | 300 | 120 | 400 | 30 | 150 | 100 | 300 | 100 | 400 | 200 | 100 | 260 | |
|
| TKCT | (-20℃~80℃) |
1500 | 4500 | 5000 | 2500 | 6000 | 1800 | 1500 | 4000 | 2000 | 6000 | 3000 | 1500 | 4000 | |||
| Curie Temp. |
Tc
|
320 | 220 | 220 | 230 | 180 | 450 | 355 | 340 | 230 | 325 | 140 | 280 | 330 | 210 | |
| Dielectric loss |
tgδ(%)
|
1.20 | 1.80 | 2.00 | 0.50 | 2.60 | 0.70 | 2.00 | 0.30 | 2.30 | 2.00 | 2.60 | 1.50 | 0.40 | 1.80 | |
| Dielectric loss | tgδ(400V/mm,%) | 1.00 | 1.00 | |||||||||||||

The piezoelectric components are bolted to the metal rod, allowing the particle displacement or velocity of the mechanical vibration of the piezoelectric components to be amplified, while ultrasonic energy is concentrated on a smaller area, known as the ultrasonic concentrator. We offer a wide range of ring-shaped components with low resonant impedance, low dielectric loss, excellent thermal stability, and high power drive.